Product Item: HB-200 Product Description: HB-200 Desktop Dual Adhesive Dispenser Product Category: Dispenser ■ Product Description: Application Scope Semiconductor sealing, PCB component fixing and protection, horn gluing, art craft cementing, quantitative adhesive filling, chip bonding technique, etc. Technology Parameters Max. Load: X/Y/Z 10/10/5KG Max. Speed:1,000mm/s Positioning precision: 0.01mm Precision resolution: 0.001 Operating stroke: 200*200*50mm, optional non-standard stroke available Controle mode: movement control card + demonstration programmer (touch screen human-machine interface demonstration programmer is optional) Motor system: Japanese micro step precision motor Program storage capacity: 100 sets Movement system: synchronous belt + precision slide rail + step motor Overall size: 360*400*4200 Input pressure: 0.5-0.7 MPa Power voltage: AC220V Environmental humility: 20-90% Weight: 30KG Performance 1) High-speed movement card + touch screen control system; easy operation training; 2) Mixed movement program function for points, lines and irregular curves; 3) Three-axle interlink to realize 3D adhesive dispension; 4) Graph by CAD/CAM software can be imported for track edition; 5) High speed air path adhesive control system providing stable and accurate adhesive quantity; 6) Circulable work mode, effectively saving energy.
Contact Person: Mr. zhang